PCBEtching
SemiconductorWetProcess
PhotovoltaicManufacturing
UltraPureChemicals
PCB/Circuit Board Manufacturing
PCB/Circuit Board Manufacturing
Wet FGD slurry with 60,000–80,000 ppm chloride at 50°C–65°C causes severe pitting and crevice corrosion. High-solids gypsum slurry (3.5%–5.0%) and cavitation can accelerate impeller wear. Mechanical seal leakage may release H
Key Challenges
Wet FGD slurry with 60,000–80,000 ppm chloride at 50°C–65°C causes severe pitting and crevice corrosion.
High-solids gypsum slurry (3.5%–5.0%) and cavitation can accelerate impeller wear.
Mechanical seal leakage may release H₂S, NH₃, and VOCs, creating safety and environmental risks.
Abrasive particles can damage bearings and seals, requiring zero-leakage magnetic drive pumps and wear-resistant wetted parts.
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