Electroplating
Coating
Anodizing
MetalSurfaceTreatment
ElectrolessNickel
Electroplating/Surface Treatment
Electroplating/Surface Treatment
PFA/PTFE-lined flow paths with zero metal wetted parts withstand HF acid service without corrosion or ion leaching High-purity fluoropolymer construction achieves metal ion leaching <0.05 ppb, safeguarding wafer yield in semiconductor we
Key Challenges
PFA/PTFE-lined flow paths with zero metal wetted parts withstand HF acid service without corrosion or ion leaching
High-purity fluoropolymer construction achieves metal ion leaching <0.05 ppb, safeguarding wafer yield in semiconductor wet processes.
Wear-resistant CD4MCu impellers and open-impeller designs handle abrasive slurry solids up to 15 mm without seal failure or clogging.
18 MΩ·cm UPW rinse and ICP-MS-verified cleanliness ensure particle shedding is virtually eliminated for ultra-pure water circulation.
WhatsApp
Facebook
LinkedIn
YouTube