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Industry-Specific Pump Solutions

Every industry presents unique fluid handling challenges. Our engineers have developed specialized pump configurations optimized for chemicals, temperatures, and operating conditions of each sector.

6
Industries
50+
Countries
10+
Years
Chemical Industry
AcidAlkaliTransfer CorrosiveMedia SolventHandling PetrochemicalProcessing ZeroLeakage Chemical Industry

Chemical Industry

Highly corrosive chemicals require corrosion-resistant and high-purity wetted parts.High-temperature and high-pressure fluids demand reliable pumps with strong corrosion resistance and cavitation resistance.Precise catalyst and chemical dosing requires hi

Key Challenges
Highly corrosive chemicals require corrosion-resistant and high-purity wetted parts.
High-temperature and high-pressure fluids demand reliable pumps with strong corrosion resistance and cavitation resistance.
Precise catalyst and chemical dosing requires high dosing accuracy, up to ±0.5%.
Strict cleanliness requirements call for low-dead-leg, low-extractables, and contamination-resistant pump designs.
Solar/Photovoltaic Industry
SolarCellEtching PVtexturing SlurryDelivery UPWcirculation ZeroMetalContamination Solar/Photovoltaic Industry

Solar/Photovoltaic Industry

Highly corrosive fluids such as KOH, HF, and HNO₃ can cause severe corrosion and contamination risks.Abrasive slurries and particles may accelerate impeller wear, clogging, and pump performance loss.Metal ion and particle contamination can affect cell qua

Key Challenges
Highly corrosive fluids such as KOH, HF, and HNO₃ can cause severe corrosion and contamination risks.
Abrasive slurries and particles may accelerate impeller wear, clogging, and pump performance loss.
Metal ion and particle contamination can affect cell quality, process stability, and production efficiency.
High-purity and precise dosing requirements demand clean, reliable pumps with excellent chemical resistance and accurate flow control.
Semiconductor Industry
UltraHighPurity CMPslurry PhotolithographyChemicals UPWcirculation ZeroParticleGeneration Semiconductor Industry

Semiconductor Industry

Highly corrosive chemicals cause corrosion and metal contamination, requiring high-purity wetted parts.CMP slurries with abrasive particles can agglomerate and settle, requiring low-shear, wear-resistant pumps.Precise chemical dosing is critical, with dos

Key Challenges
Highly corrosive chemicals cause corrosion and metal contamination, requiring high-purity wetted parts.
CMP slurries with abrasive particles can agglomerate and settle, requiring low-shear, wear-resistant pumps.
Precise chemical dosing is critical, with dosing accuracy up to ±0.5%.
Strict cleanliness requirements demand zero-leakage, low-extractables, and low-dead-leg designs.
PCB/Circuit Board Manufacturing
PCBEtching SemiconductorWetProcess PhotovoltaicManufacturing UltraPureChemicals PCB/Circuit Board Manufacturing

PCB/Circuit Board Manufacturing

Wet FGD slurry with 60,000–80,000 ppm chloride at 50°C–65°C causes severe pitting and crevice corrosion. High-solids gypsum slurry (3.5%–5.0%) and cavitation can accelerate impeller wear. Mechanical seal leakage may release H

Key Challenges
Wet FGD slurry with 60,000–80,000 ppm chloride at 50°C–65°C causes severe pitting and crevice corrosion.
High-solids gypsum slurry (3.5%–5.0%) and cavitation can accelerate impeller wear.
Mechanical seal leakage may release H₂S, NH₃, and VOCs, creating safety and environmental risks.
Abrasive particles can damage bearings and seals, requiring zero-leakage magnetic drive pumps and wear-resistant wetted parts.
Electroplating/Surface Treatment
Electroplating Coating Anodizing MetalSurfaceTreatment ElectrolessNickel Electroplating/Surface Treatment

Electroplating/Surface Treatment

PFA/PTFE-lined flow paths with zero metal wetted parts withstand HF acid service without corrosion or ion leaching High-purity fluoropolymer construction achieves metal ion leaching <0.05 ppb, safeguarding wafer yield in semiconductor we

Key Challenges
PFA/PTFE-lined flow paths with zero metal wetted parts withstand HF acid service without corrosion or ion leaching
High-purity fluoropolymer construction achieves metal ion leaching <0.05 ppb, safeguarding wafer yield in semiconductor wet processes.
Wear-resistant CD4MCu impellers and open-impeller designs handle abrasive slurry solids up to 15 mm without seal failure or clogging.
18 MΩ·cm UPW rinse and ICP-MS-verified cleanliness ensure particle shedding is virtually eliminated for ultra-pure water circulation.
Wastewater-&-Exhaust-Gas-Treatment
WastewaterTreatment ExhaustGasScrubbing Desulfurization CorrosionResistantAlloys ContinuousDuty Wastewater-&-Exhaust-Gas-Treatment

Wastewater-&-Exhaust-Gas-Treatment

HF acid (hydrofluoric) is extremely corrosive to all metalsMetal ion contamination can destroy wafer yieldCMP slurry contains abrasive particles that destroy sealsZero particle shedding required for ultra-pure water systems

Key Challenges
Wet FGD slurry with 60,000–80,000 ppm Cl⁻ at 50°C–65°C causes severe pitting and crevice corrosion, with 316L failing within 48 hours
High-solids gypsum slurry (3.5%–5.0%) and cavitation at off-design operation cause impeller mass loss up to 2.5 g/100 hours
Mechanical seal leakage releases H₂S, NH₃, and VOCs (0.5–2.0 L/day per pump), exposing plants to fines of USD 70,000–280,000 per incident
Trace particulates and abrasive media destroy bearings and seals, requiring zero-leakage magnetic drive or wear-resistant wetted parts